Laser Machine

  • Universal PLS4.75

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    Universal PLS4.75

    Platform Overview

    The PLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).

  • Universal VLS6.75

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    Universal VLS6.75

    Platform Overview

    The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.

  • Universal VLS4.75

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    Universal VLS4.75

    Platform Overview

    The VLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.

  • Universal VLS3.75

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    Universal VLS3.75 The VLS3.75 is a free-standing platform with a materials processing envelope of 24" x 12" x 8.5" or 2,592 in³ (610 x 305 x 216 mm or 40,187 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.
  • Universal VLS3.60DT

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    Universal VLS3.60DT The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.
  • Universal VLS2.30DT

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    Universal VLS2.30DT The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source.
  • Universal Ultra R5000 The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.  
  • Universal Ultra X6000 The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.  
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